In essence, a copper ground pour refers to an area in a signal layer on a PCB that has been filled with copper. In addition, information on another type of fill-a signal layer fill-is provided along with its uses and benefits. This article will describe the history of these pours, their claimed advantages and disadvantages and why they are not valid.

The ultimate result is that there are no pluses in using copper ground pours.

Yet another individual claimed that it makes the board less expensive to manufacture while right next to them was someone who claimed it makes the manufacturing process more difficult. One person said a ground fill pour reduces EMI, another stated that it balances the copper and makes the board less likely to warp. There were arguments on both sides of the question. Recently on the SI-List, aka the SI Reflector, (see note at the end of this article) there’s been a spate of activity around the topic of copper ground pours and whether they are advantageous in a multilayer PCB implementation. On Shaky Ground-the Arguments Against Copper Pours

Diptrace remove copper pour